Chip Packaging

应用领域

芯片封装

半导体衬底——芯片封装核心支撑，以高导热、低损耗、优异兼容性及精密尺寸控制，赋能功率器件、射频芯片、先进封装（SiP/Chiplet）等场景，筑牢芯片散热、信号传输与结构集成的可靠根基，助力封装效率与器件性能双重升级。

Semiconductor Substrate – the core backbone for chip packaging. With high thermal conductivity, low loss, excellent compatibility, and precision dimensional control, it empowers power devices, RF chips, advanced packaging (SiP/Chiplet), and other scenarios. It lays a solid and reliable foundation for chip heat dissipation, signal transmission, and structural integration, enabling dual upgrades in packaging efficiency and device performance.